Technology Roadmap

Technology Road Map

Rigid/Flex Current Rigid Past
Layer Count 28 and Above 2-26
Line Widths Min 0.003" Min 0.004"
Spacing Min 0.004" Mine 0.004"
Board Thickness Max 2.500 Max 2.00"
Aspect Ratio 12:1 10:1
Base Material Getek, Nelco, Arlon, Cyanate, Ester FR-4, High TG FR-4, Polymide, Rogers, Teflon
Impendence Ctrl + 8% +10%
SMT Pitch Min 0.006" Min 0.0065"
Via Pad Size 0.014" Min 0.016"
Blind/Buried Via HDI (Laser) Sequential Lamination
Pth Size Min 0.004 (Laser) Min 0.008 (Machine)
Drill Position Accuracy + 0.0016" +0.003
Plugged Hole Size Max 0.028" Max 0.022"
Core Thickness Min 0.003" Min 0.004"
Thick Foil 6 oz (Interior and Exterior) 4 oz (Interior and Exterior)
Board Size Max 22.25" x 22.8" Max 22.25" x 22.8"
Warp and Twist <0.5% <0.7%
External Heatsinks Steel Aluminum, Copper
Solder Mask Taiyo PSR40000, Ethone Taiyo PSR4000, Ethone
S/M Thickness Min 0.0005" Min 0.0004"
S/M Clearance 0.002" 0.002"
Surface Finish OPS (Entek 106A), HASL, Immersion Gold, Deep Tank Hard and Soft Gold, Immersion Tin, Carbon Ink
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